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Designing Thermoplastic Nanocomposites for High Energy Absorption and Epoxy-based Underfills for Electronic Packaging
Prof Yiu-Wing Mai, University Professor and Personal Chair in Mechanical Engineering, The University of Sydney; Visiting Professor of HKUST Jockey Club Institute for Advanced Study
Date : 6 Oct 2017 (Friday)
Time : 3:00 - 4:30 pm
Venue : Chen Kuan Cheng Forum (LT-H), HKUST
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In this lecture, the speaker will examine two specific applications of polymer nanocomposites.

High Energy Absorption of Thermoplastic Nanocomposites
Engineering thermoplastics, such as nylons and polypropylenes, incorporated with nano-fillers, such as clay, rubber, silica, CNTs, etc. have often been used as secondary structures and components (e.g., fuel tanks, under-the-hood parts, bumpers) in automobile manufacturing due to their low-cost, lightweight, reparability, recyclability, net-shape formability, etc. Although the benefits of higher stiffness, improved strength, better thermal stability and increased barrier properties can be achieved in these nanocomposites, their insufficient ductility and low impact energy have greatly limited their wider acceptance. Here, the speaker will show how polyamide (PA) can be toughened with controlled distributions of hybrid clay and rubber fillers. He will also demonstrate a new concept of toughening PP/CaCO3 nanocomposites with submicron-sized voids produced during melt processing.

Designing Epoxy Underfills for Electronic Packaging
Underfill process using epoxy-based materials is a critical part of reliable electronic packaging. The key requirements for high performance underfills are: thermal conductivity >1 W/mK, CTE<20-30 ppm/oC, low viscosity <20 Pa.s and high electrical insulation. Their past and current efforts to achieve excellent electrical insulation, reduced interfacial thermal resistance and lowered viscosity epoxies filled with nanoparticles will be discussed.



About the speaker

Prof Yiu-Wing Mai received his BSc(Eng), PhD, DSc degrees from the University of Hong Kong (HKU) in 1969, 1972 and 1999, respectively. He obtained his DEng from the University of Sydney in 1999. In 1976, Prof Mai joined the University of Sydney, where he is currently University Chair and Professor of Mechanical Engineering.

Prof Mai's main research interests cover a few areas: (1) materials science and engineering covering processing-structure-property relations, manufacturing and development of innovative materials; (2) smart materials, eco-materials and biomimetics; (3) nanomaterials and nanoengineering; (4) fracture and fatigue mechanics of materials and structures; (5) design, characterization and mechanics of interfaces / interphases; (6) tribology and surface engineering and science.

In recognition of his scholarly achievements, he was elected to the Fellowships of the Royal Academy of Engineering (2011), the Royal Society (2008), the Australian Academy of Science (2001) and the Australian Academy of Technological Sciences and Engineering (1992). For his service to engineering and contribution to scientific research, he was honored with AA Griffith Medal and Prize by the UK Institute of Materials, Minerals and Mining (IOM3) (2016), AGM Michell Medal by Engineers Australia (2016), DSc honoris causa from HKU (2013) and the Order of Australia (2010).


For attendees’ attention


  The lecture is free and open to all. Seating is on a first come, first served basis.



HKUST Jockey Club Institute for Advanced Study
Enquiries: ias@ust.hk / 2358 5912