Prof Junzhi Cui from the Chinese Academy of Science presents his research on the mechanical behavior for metallic nano-scale devices based on ACC model, which couples the continuum model with molecular dynamics.
The mechanical behavior for metallic nano-scale devices based on ACC model, which couples the continuum model with molecular dynamics (MD) and is proposed by Xiang et al, is studied in this paper. Some essential concepts from MD to continuum mechanics are defined, such as representative volume element (RVE), atomic occupation coefficient, basic deformation element, deformation environment and so on. The calculating formulae of some mechanical quantities, including deformation gradient, stress tensor etc., are derived in detail from those. And all of those for the single-crystal Cu nanowire under tension and bending are numerically simulated. The results show the inhomogeneity of strain and stress tensor in Cu nanowire under tension and bending. Based on continuum model, ACC and MD the Recursively adaptive multi-scale algorithms are shown.
About the speaker
Prof Junzhi Cui is currently Professor at the Institute of Computational Mathematics and Science/Engineering Computing (ICMSEC) of the Chinese Academy of Sciences (CAS). He has been working in the Institute of Computing Technology, Center of Computing and the ICMSEC since 1962. He was Director of Center of Computing and Vice-Chairman of the Chinese CODATA Committee. He serves as associate editor or editorial board for nine journals. He is Adjunct Professor or member of advisory committee or academic board for more than 10 universities and laboratories, including the Ministry of Housing and Urban-Rural Development of the People’s Republic of China, Northwestern Polytechnical University, Zhengzhou University, etc.
Prof Cui is an expert in computational mathematics, computational mechanics and software engineering. In 1964, he developed the first general finite element program for plane problem and solved the complex stress analysis of Liujiaxia Dam. In 1973, for the first time, he brought out the correlation between loading route and the stress state in contact and effectively solved the stress analysis problem for complex structures. He is a Member of the Chinese Academy of Engineering.
